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BOE Etching Solution

Product Name BOE Etching Solution
Grade EL, MOS


BOE (Buffered Oxide Etch) is a type of etching solution commonly used in microfabrication and semiconductor manufacturing processes. It is specifically designed for etching and removing silicon dioxide (SiO2) or oxide layers from silicon wafers or other semiconductor substrates. The solution typically consists of a mixture of hydrofluoric acid (HF) and ammonium fluoride (NH4F) in a specific ratio. The combination of these chemicals provides an effective means of selectively etching silicon dioxide while minimizing attacks on other materials.


The use of BOE in semiconductor manufacturing is critical for various applications, including the production of integrated circuits (ICs) and other microelectronic devices. It allows for precise removal of oxide layers without damaging the underlying silicon substrate. The selectivity of BOE is crucial in achieving high-resolution patterns and well-defined structures on the semiconductor wafer.


Unlock the precision of your semiconductor production approaches demand with UniVOOK Chemical’s BOE Etching Solution. Engineered to perfection, this Buffered Oxide Etch (BOE) solution is a critical tool for reaching selective and managed elimination of silicon dioxide layers in microfabrication.


Features: BOE Etching Solution

Selective Oxide Removal:

UniVOOK Chemical’s BOE Etching Solution is adept at selectively etching silicon dioxide even as retaining the integrity of the underlying silicon substrate. This selectivity ensures the creation of complex and nicely described patterns vital for semiconductor gadgets.

Buffered Stability: 

The inclusion of a sturdy buffer device guarantees a vital pH stage all through the etching manner. This buffered stability contributes to regular and managed etching rates, permitting dependable outcomes in semiconductor production.

High Purity Components: 

Formulated with excessive-purity hydrofluoric acid (HF) and ammonium fluoride (NH4F), this BOE solution meets the stringent necessities of semiconductor fabrication. The use of high-purity components minimizes impurities, enhancing the reliability and reproducibility of the etching method.

Enhanced Safety Protocols:

UniVOOK Chemical prioritizes protection within the coping with of its BOE Etching Solution. The system takes into consideration the dangerous nature of hydrofluoric acid, and suitable safety measures are implemented to ensure the well-being of customers.

Optimized for Semiconductor Applications:

Tailored to fulfill the traumatic desires of semiconductor production, UniVOOK Chemical’s BOE Etching Solution supports the advent of tricky microelectronic systems, making sure high-decision patterns and precise oxide removal.


Related Product: Mo/Al/Mo Etching Solution


Buffered oxide etchant (BOE) is a liquid etchant used for micromachining. Its main application is to etch thin films of silicon dioxide (SiO2) or silicon nitride (Si3N4). We provide BOE etching solutions with different ratios: 5:1; 6:1; 7:1; 20:1 etc.

Health & Safety

For more details and safety recommendations regarding the use of the product, please consult our Material Safety Data Sheet (MSDS), or Contact With our Product Manager.


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